Cookson Electronics Semiconductor Products
About Us

Cookson Electronics Semiconductor Products (CESP) is the business unit within Cookson Electronics that is completely focused on the needs of the semiconductor packaging industry.

Cookson Electronics Semiconductor Products (CESP) is a leading supplier of innovative, high performance materials, tailored to the needs of the leading semiconductor packaging manufacturers and delivered with knowledgeable applications expertise.  Our products enable our valued customers to meet the evolving and demanding needs of the industry.

CESP supplies products in three product areas:

1. Soldering Products:  Sold under the known and trusted brand of ALPHA®, CESP supplies:
1. BGA Flux;
2. Flip Chip Flux;
3. Solder Paste for several semiconductor packaging applications:
1. Passive Attach
2. Wafer Bumping
3. Die Attach; and
4. Solder Spheres
5. as well as flux and solder paste for a range of other engineered applications
   
   
2. Epoxy Molding Compound:  Sold under the leading brand PLASKON®, CESP supplies leading product technology for several important applications:
1. Power Devices: PLASKON® mold compounds can specifically meet the demanding electrical and mechanical requirements of high voltage and amperage power devices.
2. Memory Cards: CESP offers EMC for microSD, MSDuo and other fully molded packages that utilize thin mold caps and 1-up MAP molding.
3. Area Array Devices: Including PBGA, QFN, SiP and Package-on-Package devices.  CESP is meeting emerging industry needs for high reliability packaging and superior mold-ability.
   
   
3. Electronic Polymers:  CESP supplies products for several emerging applications:
1. Getters:  Specialty materials are supplied to scavenge hydrogen, moisture, and particles to allow for reliable use of high reliability hermetic and near-hermetic packages, including MEMS and MOEMS devices.
2. Moisture Barrier Seal:  Polymeric-based materials are supplied for sealing near hermetic packages with an effective moisture barrier to enable long, reliable use of MEMS/MOEMS packages.
3. No-flow Underfills:  CESP offers low cost of ownership solutions that enable underfilling of small gap and fine pitch flip chip devices, chip on wafer and wafer stacking applications.
4. Conductive Adhesives:  Highly conductive adhesives are being developed that provide the high thermal conductivity of solders, coupled with the high throughput, high compliance, and low cost-of-ownership of silver-filled epoxies.

CESP’s US headquarters are located in Atlanta, USA, and its Asia operations are based out of Singapore.
For questions concerning orders, product information, or technical support, please contact one of our sales contacts provided.  We are here to assist you achieve your packaging goals.

US-based Headquarters:
1350 John Creek Court – Suite 300
Suwanee, GA 30024
1-678-475-6900

Asia-based Headquarters:
12 Joo Koon Road-
628975 Singapore
65-6861-0244