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We are committed to providing the global semiconductor packaging manufacturers with innovative, high performance materials. Our products enable our valued customers to meet the evolving and demanding needs of the industry.
 
Epoxy Mold Compound EMC
EMC for Power Devices
EMC for Memory Cards
Molded Underfill		 Moisture Getters
Particle Getters
Hydrogen Getters
Moisture Barrier Sealant
Conductive Adhesives
Non-conductive Adhesives
No-flow Underfills NUF		 Flux Ball Attach Flip Chip
Spheres
Solder Paste