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Research and Development

CESP is a leader in the development and supply of innovative materials used in emerging semiconductor packaging applications such as high voltage and automotive power devices, memory cards, BGA's, CSP's, QFN’s, MLP’s, flip chip devices, 3D packages, MEMS and MOEMS packages.

CESP’s Soldering Products R&D leverages the knowledge and experience from the world leader in solder technology – Alpha, based out of New Jersey, USA.  CESP’s Epoxy Molding Compound R&D is based in Singapore, with a fully equipped validation lab, capable of simulating our customers process – both in terms of packaging and in reliability and electrical testing.  CESP’s electronic polymers R&D occurs at the Atlanta, USA site and leverages an exceptional pool of talent, with a state-of-the-art laboratory.  Our research facilities are continually updated, utilizing the latest analytical and application test equipment. This maximizes our ability to understand our customers' processes and to responsively assist in resolution of technical challenges as they arise.

In support of Cookson Electronic's strategic vision to be the leading supplier and development partner for our valued customers, CESP closely collaborates with the industry’s technology leaders to enable innovative solutions to emerging packaging needs.  Our worldwide presence provides the ability to work in close partnership with our customers on a day-to-day basis in a seamless, cooperative relationship. This partnership process enables customers to effectively expand their own technical and development capabilities and come up with better overall solutions. CESP closely partnered, cooperative development projects allow both our own business, as well as our customers', to maintain a competitive advantage in this most challenging environment, where technology advances at a rapid pace.

Manufacturing Excellence

CESP is dedicated to producing high quality materials with consistent performance, meeting the demanding requirements of the Semiconductor Industry.  This is achieved through stringent Computer Aided Distributed process controls and quality assurance tests that are performed throughout the manufacturing process, as well as conformance and certifications to International Quality Assurance Standards. Our Process and Quality Assurance Engineers are trained in the latest statistical and problem-solving techniques and use a team approach in striving to continuously improve our processes and quality systems. Our exacting control means that you can expect consistent performance from each shipment.  Our well developed manufacturing and quality systems allow us to scale from low volume to high volume manufacturing in the shortest amount of time, with reproducible results, allowing for the seamless scaling of new products for new programs.
 

Environmental Policy

We shall strive to ensure that our operation and products do not endanger our employees, contractors, customers, community and environment through continuous improvements in our operations, products and environmental pollution prevention.