PLASKLEEN®
Mold Cleaning Compound
This material is a melamine-based, transfer-grade mold cleaning compound. It has been specially formulated for the efficient cleaning of molds that use epoxy resins for electronic packaging. It is a blend of organic and inorganic fillers with a thermosetting resin that is designed to minimize yellowing and chipping, while maximizing cleaning efficiency.
Melamine Mold Cleaning Compound
This material is designed for compression cleaning molds used with epoxy molding compounds. This cellulose-filled, melamineformaldehyde product is available in either a white granular form or as performs specifically designed to facilitate charging the mold.
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