| Cookson Electronics offers a full line of thermoplastic and thermosetting polymer bonding products. STAYSTIK™ products cover a complete range of mechanical, electrical and thermal properties and be used for temporary mounting or permanent bonding. Specific enabling technology products support stringent industry reliability standards; including JEDEC and MILSPEC. STAYSTIK™ products are the premier choice for all of your high performance bonding applications. |
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| Cookson Electronics offers a full line of encapsulants to meet your assembly and packaging needs. STAYCHIP™ encapsulants cover a wide range of mechanical properties for protecting FCIP, FCOB and CSP solder joints with optimized adhesion, modulus, CTE, Tg and moisture stability. Specific enabling technology products support stringent industry JEDEC and automotive reliability standards. STAYCHIP™ Underfills are the premier choice for all of your high performance encapsulants and bonding applications. |
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| Cookson Electronics offers a full line of getter products that improve working life and reduces field failures. HiCap™, STAYDRY™, GA and H2 products are formulated to scavenge moisture, particles and hydrogen. Products cover a range of mechanical properties and application techniques. Specific enabling technology products support stringent industry reliability standards; including JEDEC and MILSPEC. |
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| Cookson leads the way in the
development of enabling conductive
adhesives that meet the increasingly
more complex demands of today’s
semiconductor, medical, military,
display, MEMS assembly processes
and reliability requirements.
Cookson Electronics Polysolder
products provide junction stability
in harsh environments.
Specifically designed for electronic
component assembly, Cookson
Electronics Polysolder products
are lead-free, no clean, and
environmentally-acceptable solder
substitute. |
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