POLYSOLDER Conductive Adhesives
HiCap™ and STAYDRY™ Getters for improved working life

Cookson leads the way in the development of enabling conductive adhesives that meet the increasingly more complex demands of today’s semiconductor, medical, military, display, MEMS assembly processes and reliability requirements. Cookson Electronics Polysolder products provide junction stability in harsh environments. Specifically designed for electronic component assembly, Cookson Electronics Polysolder products are lead-free, no clean, and environmentally-acceptable solder substitute. Tailored rheology allows for a variety of application methods which include screen printing, stencil printing or dispensing. Polysolder products cover a range of mechanical, electrical and thermal properties. The paste is hardened by thermal processing in IR, convection, or box oven equipment. Benefits compared to standard solder paste include low temperature processing and improved stress absorbing properties. This patented product is a unique metal filled polymer material matrix that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging.

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