STAYCHIP™ Underfills
STAYCHIP™ for encapsulant and bonding applications

Cookson Electronics offers a full line of encapsulants to meet your assembly and packaging needs. STAYCHIP™ encapsulants cover a wide range of mechanical properties for protecting FCIP, FCOB and CSP solder joints with optimized adhesion, modulus, CTE, Tg and moisture stability. Specific enabling technology products support stringent industry JEDEC and automotive reliability standards. STAYCHIP™ products are the premier choice for all of your high performance encapsulants and bonding applications.

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