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'No Flow' Underfill reliability is Here-Finally! by Mike Previti |
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150 micron pitch Pb-free flip-chip packaging with Cu/Low-k Interconnects |
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Chip Scale or Flip Scale - The Wrong Question by Ken Gilleo |
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Embedded passive PWB construction using STAYSTIK 301 |
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Getters-Molecular Scavengers for Packaging by Ken Gilleo |
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Hydrogen Effects on GaAs Microwave Semiconductors from Shanson Microwave Corporation |
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Kinetic Modeling of No-Flow Underfill Cure and Its Relationship to Solder Wetting & Voiding by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield |
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Materials and Processes for MR and GMR Heads and Assemblies by Ken Gilleo, Nathan Kerrick and Gary Nicholls |
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MEMS Packaging Issues and Materials by Ken Gilleo |
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Molded Underfill for Flip Chip in Package by Ken Gilleo |
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New Generation Underfills Power the 2nd Flip Chip Revolution by Ken Gilleo |
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Possibilities and Limitations of No-Flow fluxing Underfills by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield |
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STAYSTIK 301 with embedded passive PWB construction |
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The Chemistry & Physics of Underfill by Ken Gilleo |
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The Great Underfill Race by Ken Gilleo & Dave Blumel |
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The Ultimate Flip Chip-Integrated Flux/Underfill by Ken Gilleo & Dave Blumel |
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Thermoplastic Adhesives - The Attachment Solution for Multichip Modules by Ken Gilleo, Thomas Cinque, Steve Corbett and Christopher Lee |
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Thermoplastic Die Attach Adhesive for Today's Packaging Challenges by Ken Gilleo |
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Thermoplastic Die Attach for Hermetic Packaging by Peter R. Harper |
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Underfill-Induced Stresses in Flip Chip Assemblies by James Hurley, and Tanya Berfield |
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Utilization of die attach adhesive in wafer assembly of cavity packages for image sensors |
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