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101G, 211G, 301G, 701G |
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2078E No-Flow Fluxing Underfill |
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3082 High Reliability Flip Chip Underfill |
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3090.mk.01 High Productivity Capillary Underfill |
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H2-3000 Hydrogen and moisture getter |
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HEL30 Corner-fill conding adhesive w/ extended floor time |
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HiCap 2000 High capacity moisture and CO2 getter |
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Polysolder LT Silver filled electronically conductive paste |
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Resin E |
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SD 800 Low temperature moisture getter |
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SE3001 Microdot dispensing silver-filled electronically conductive paste |
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Silver Filled Epoxy |
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STATSTIK 571, 672, 872, 472 |
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STAYCHIP 2078E |
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STAYCHIP 2078E No-flow fluxing underfill for Sn/Pb joints |
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STAYCHIP 3075F |
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STAYCHIP 3075F Unfilled capillary underfill |
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STAYCHIP 3082 Capillary underfill |
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STAYCHIP 3090 Long pot life and fast cure capillary underfill |
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STAYCHIP 81-3 No-flow fluxing underfill |
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STAYCHIP HEL 30 |
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STAYDRY GA 2000-2 |
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STAYSTIK 101, 211, 301, 701 Thermoplastic adhesive |
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STAYSTIK 1172 |
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STAYSTIK 141, 242, 343 |
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STAYSTIK 171, 272, 371,773 |
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STAYSTIK 181, 282, 783, 383 |
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STAYSTIK 191, 292, 793, 393 |
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STAYSTIK 301 |
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STAYSTIK 336T |
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STAYSTIK 501, 611, 811, 415 |
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STAYSTIK 541, 642, 842, 442 |
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STAYSTIK 571, 672, 872, 472 |
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STAYSTIK 581, 682, 882, 482 |
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STAYSTIK 591, 692, 892, 492 |
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STAYSTIK 8000 |
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STAYSTIK SS1172 |
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