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Solder Products|Epoxy Mold Compounds|Electronic Polymers

3075F

Unfilled capillary underfill

Product Documentation

Technical Data Sheets
Contact your Cookson Electronics representative for the Technical Data Sheet

Selector Guide
	STAYCHIP™ Underfill Selector
	Electronic Polymers Selector Guide

Technical Articles
	Underfill-Induced Stresses in Flip Chip Assemblies by James Hurley, and Tanya Berfield
	Kinetic Modeling of No-Flow Underfill Cure and Its Relationship to Solder Wetting & Voiding by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield
	Possibilities and Limitations of No-Flow fluxing Underfills by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield
	The Ultimate Flip Chip-Integrated Flux/Underfill by Ken Gilleo & Dave Blumel
	'No Flow' Underfill reliability is Here-Finally! by Mike Previti
	The Chemistry & Physics of Underfill by Ken Gilleo
	Molded Underfill for Flip Chip in Package by Ken Gilleo
	150 micron pitch Pb-free flip-chip packaging with Cu/Low-k Interconnects

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