STAYCHIP™ 3082

STAYCHIP™ 3082 is a highly filled, high reliability capillary underfill designed for high performance applications. This material provides superior adhesion to common solder-mask and die passivations, even after exposure to elevated heat, pressure, and humidity for superior JEDEC performance. This fast flow underfill was formulated for penetration of gaps below 1 mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and exhibits low moisture absorption for improved JEDEC performance.

Product Documentation

Technical Data Sheets 3082 High Reliability Flip Chip Underfill Selector Guide STAYCHIP™ Underfill Selector Electronic Polymers Selector Guide Application Bulletins Definitions of Dielectric Properties STAYCHIP™ Capillary Underfills - Process Guidelines STAYCHIP™ Capillary Underfills - Troubleshooting Guide STAYCHIP™ Capillary Underfills - Application Guidelines Technical Articles Underfill-Induced Stresses in Flip Chip Assemblies by James Hurley, and Tanya Berfield Kinetic Modeling of No-Flow Underfill Cure and Its Relationship to Solder Wetting & Voiding by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield Possibilities and Limitations of No-Flow fluxing Underfills by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield The Ultimate Flip Chip-Integrated Flux/Underfill by Ken Gilleo & Dave Blumel 'No Flow' Underfill reliability is Here-Finally! by Mike Previti The Chemistry & Physics of Underfill by Ken Gilleo Molded Underfill for Flip Chip in Package by Ken Gilleo 150 micron pitch Pb-free flip-chip packaging with Cu/Low-k Interconnects

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