STAYCHIP™ 3090

STAYCHIP™ 3090 is a highly filled, high reliability capillary underfill designed for high productivity flip applications. This material merges excellent stability with fast cure speed, fast flow times, and exceptional reliability performance. The reactivity of Staychip 3090 allows shipment of material in bulk quantities up to 20 ounce cartridges and storage in a conventional refrigerator at 5°C.

Product Documentation

Technical Data Sheets 3090.mk.01 High Productivity Capillary Underfill Selector Guide STAYCHIP™ Underfill Selector Electronic Polymers Selector Guide Application Bulletins Definitions of Dielectric Properties STAYCHIP™ Capillary Underfills - Process Guidelines STAYCHIP™ Capillary Underfills - Troubleshooting Guide STAYCHIP™ Capillary Underfills - Application Guidelines Technical Articles Underfill-Induced Stresses in Flip Chip Assemblies by James Hurley, and Tanya Berfield Kinetic Modeling of No-Flow Underfill Cure and Its Relationship to Solder Wetting & Voiding by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield Possibilities and Limitations of No-Flow fluxing Underfills by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield The Ultimate Flip Chip-Integrated Flux/Underfill by Ken Gilleo & Dave Blumel 'No Flow' Underfill reliability is Here-Finally! by Mike Previti The Chemistry & Physics of Underfill by Ken Gilleo Molded Underfill for Flip Chip in Package by Ken Gilleo 150 micron pitch Pb-free flip-chip packaging with Cu/Low-k Interconnects

Looking for a different product? Try our convenient Product Search Tool.