ALPHA NCP Lead-Free Solder Paste

ALPHA NCP is a lead-free, no-clean solder paste designed for a broad range of semiconductor applications including fine feature component attach, ball attach, and substrate bumping. ALPHA NCP’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. ALPHA NCP yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.

Product Documentation

Technical Data Sheets ALPHA NCP Solder Paste Selector Guide Solder Products Selector Guide

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