ALPHA Solder Spheres

ALPHA Solder Spheres are designed for BGA, CSP, and Flip Chip wafer bumping applications. ALPHA Solder Spheres are available in a wide range of lead-free, tin-lead, high-lead, low-silver, and custom alloys in a variety of common diameters. ALPHA Solder Spheres are made to the highest quality control standards to assure consistent sphere size, uniformity and alloy content.

Product Documentation

Technical Data Sheets ALPHA Solder Spheres Selector Guide Solder Products Selector Guide Application Bulletins Quality Assurance Oxidation ESD Packaging Coplanarity Issues for BGAs Bumping BGA Packages BGA Package Solder Bump Quality How and Why Solder Bumps Wrinkle After Reflow and a PBGA

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