ALPHA WSX Water-Soluble

ALPHA WSX water soluble flux is engineered to be used in the attachment of lead-free or tin-lead eutectic spheres onto BGA or CSP components. It is highly compatible with Cu-OSP, electrolytic Ni-Au and ENIG pad finishes. ALPHA WSX is a halide-free material with best-in-class fluxing activity resulting in maximized yield.

Product Documentation

Technical Data Sheets ALPHA WSX Flux Selector Guide Solder Products Selector Guide Application Bulletins Bumping BGA Packages BGA Package Solder Bump Quality How and Why Solder Bumps Wrinkle After Reflow and a PBGA

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