ALPHA WSX-FD Water-Soluble Flux

ALPHA WSX-FD water soluble flux is engineered to be used in the placement and reflow of high lead or Pb-Free solders for direct chip attach. It is highly compatible with Cu-OSP, electrolytic Ni-Au and ENIG pad finishes. Before reflow, this flux provides sufficient tack to hold the flip chip in place. After reflow the flux residue is completely water soluble, facilitating cleaning.

Product Documentation

Technical Data Sheets ALPHA WSX-FD Selector Guide Solder Products Selector Guide Application Bulletins Bumping BGA Packages BGA Package Solder Bump Quality How and Why Solder Bumps Wrinkle After Reflow and a PBGA

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