LT

This material is a lead-free, no clean, environmentally acceptable solder substitute specifically designed for electronic component assembly, especially surface mount. This product is can be screen printed, steciled or pneumatically dispensed as a thixotropic paste. The material is hardened by thermal processing in IR, convection, conduction or vapor phase equipment. This patented product is a unique electronics polymer material that forms stable electrical and mechanical junctions with standard components, even after extended environmental aging.

Product Documentation

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