STAYCHIP™ NUF 2078E

STAYCHIP™ 2078E no-flow underfill is used to perform the dual functions of a solder flux and an underfill between (1) a flip chip die and a substrate or (2) an area array device and a printed circuit board. This material functions as a flux as it solders Sn63/Pb37 bumped pads to common pad metallizations (eutectic Sn/Pb, Cu/Ni/Ag, and OSP coated Cu), using a conventional reflow profile. The product also functions as an underfill as it cures during the conventional reflow profile, immediately after soldering, forming a stress absorbing, compliant matrix that distributes the stress imposed by the CTE mismatch between the die and substrate. This matrix provides enhanced environmental protection and shock resistance.

Product Documentation

Technical Data Sheets Contact your Cookson Electronics representative for the Technical Data Sheet Selector Guide STAYCHIP™ Underfill Selector Electronic Polymers Selector Guide Application Bulletins No Flow Underfill - Process Guidelines Technical Articles Underfill-Induced Stresses in Flip Chip Assemblies by James Hurley, and Tanya Berfield Kinetic Modeling of No-Flow Underfill Cure and Its Relationship to Solder Wetting & Voiding by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield Possibilities and Limitations of No-Flow fluxing Underfills by James Hurley, Xiaoyun (Sherry) Ye and Tanya Berfield The Ultimate Flip Chip-Integrated Flux/Underfill by Ken Gilleo & Dave Blumel 'No Flow' Underfill reliability is Here-Finally! by Mike Previti The Chemistry & Physics of Underfill by Ken Gilleo Molded Underfill for Flip Chip in Package by Ken Gilleo 150 micron pitch Pb-free flip-chip packaging with Cu/Low-k Interconnects

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