| Unique formulations developed for challenging processes characterize the ALPHA® flux product line from our Best-in-Class
WSX water-soluble to our NCX no-clean. No matter what your application requirements are, there is an ALPHA® flux that will meet your need. |
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| For ball grid array (BGA), chip scale packages (CSP) and flip chip bumping applications, we can meet your solder sphere
specifications with a wide range of lead-free, eutectic, high lead and custom alloys available in a variety of common diameters.
ALPHA® spheres are made to the highest quality control standards to assure consistent sphere size, uniformity and alloy content. |
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| ALPHA® no-clean and water-soluble solder pastes for componentattach, die-attach and wafer bumping applications meet challenging lead-free and eutectic processing needs. These products were developed to deliver excellent printing and dispensing performance, while maximizing process throughput and yield. |
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